WebJan 10, 2013 · Favored due to reduced stress on the precious processed dies, low temperature de-bonding via UV-laser irradiation is widely used for back-end-of-line … WebOct 11, 2012 · A novel insulated gate bipolar transistor (IGBT) featuring thin-wafer processing and a combined dopant activation laser annealing and contact metal laser …
(PDF) Wafer through-hole interconnections with high vertical …
WebNov 12, 2010 · This chapter describes the necessity that carrier techniques be developed for thin wafer handling and processing. After an explanation on the main requirements for … WebJan 1, 2024 · Thus, the progresses of ultra-thin wafer technology from manufacturing process to wafer transportation and device application are reviewed herein. The … cutting printer that cuts out contact paper
Ultra-thin wafer technology and applications: A review
WebOct 1, 2013 · Wafer thinning is the process of removing material from the backside of a wafer to a desired final target thickness. The two most common methods of wafer … WebNov 12, 2010 · The purpose of backgrinding is to thin a wafer while processing silicon that is in a brittle mode; it is done with a grinding wheel using diamond abrasive grains. This … Only single-side grinders that grind one side of the wafer can be used for back … However, in recent years the price of silicon wafers has dropped significantly. The … Six in. p-type Si wafer of ∼650 μm thick was used as a substrate and sputtered Cu … Highlights Development of automatically feed-back process for improving total … This Epifree process is divided into five steps, namely (1) formation of regular … Problems associated with such ultra-thin Si wafers range from basic wafer handling … We have studied low temperature plasma processes (T sub ≤200 °C) for the … cheap docs